Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due to new device ...

The Fast Company Executive Board is a private, fee-based network of influential leaders, experts, executives, and entrepreneurs who share their insights with our audience. BY Sviat Dulianinov The AI ...

Design-for-assembly (DFA) and design-for-manufacture (DFM) techniques can be applied to products assembled manually or automatically or manufactured by specific techniques, such as machining, die ...

The use of Artificial Intelligence (AI) into 3D product design is increasingly impactful, especially during the initial stages of image creation, brainstorming and conceptualization. A variety of AI ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

In 2015, fashion brand manager Ben Demiri, industrial engineer Goncalo Cruz and Farfetch CEO José Neves co-founded PlatformE, a business to help brands implement made-to-order production. The software ...

When brands design and sample digitally, achieving a true-to-life look is the goal. However, for many garments, a realistic look comes down to what’s not visible: the interlinings. Interlinings, or ...

In part one of this two-part article, design engineer Michael Paloian outlined the first four milestones of a product-design project, ending with the “cornerstone” of the product-design cycle — ...