The semiconductor industry is a hallmark of technological innovation, evolving rapidly to meet the demands of an increasingly digital world. At its core, semiconductor manufacturing involves two main ...
TOKYO, Oct. 1, 2025 /PRNewswire/ -- Nikon Corporation is reaffirming the availability of its Digital Lithography System, DSP-100, with orders having commenced in July 2025. This system is specifically ...
Rapidus Chiplet Solutions, a new R&D facility and clean room, will be located on Seiko Epson's Chitose campus TOKYO and HOKKAIDO, Japan, Oct. 3, 2024 /PRNewswire/ -- Rapidus Corporation, a company ...
TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...
TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
Tokyo, Japan, December 9, 2025-- FUJIFILM Corporation announced the launch of “ZEMATES™*1,” a new brand of photosensitive insulating materials for semiconductor back-end processes, centered on ...
Kenmec Mechanical Engineering has entered into an exclusive agency agreement with German humanoid robot startup Neura Robotics to enhance intelligent in-factory logistics, with an initial focus on ...
Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...
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