Tessera Inc. Friday will unveil a new ultra-thin tri-fold stacked chip-scale package (CSP) co-developed with Intel Corp. for that firm's highest-density flash memory. Bruce McWilliams, president and ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which ...

CHANDLER, Ariz.–Chip-packaging giant Amkor Technology Inc. said it is expanding capacity for stacked chip-scale packages (S-CSP) to meet huge OEM demand. Already among the largest producers of stacked ...

Hynix Semiconductor announced the launch of its small-scale DRAM packaged with FBGA (frame ball-grid array) CSP (chip-scale package) technology. The company has already completed the set-up of ...

Maxim Integrated Products introduces the MAX8884Y/MAX8884Z 700mA step-down converters with dual 300mA LDOs in a 2 x 2 mm CSP (chip-scale package). Maxim Integrated Products introduces the ...

Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces the processing ...

Study assesses the four major phosphor-LED types: ceramic, polymer, chip- on-board, and chip-scale. Washington, DC, USA -- If current trends in research and development continue, LED lighting is ...