Arteris Announces Collaboration with IC-Link by imec to Accelerate Next-Gen AI and HPC Silicon

(Nasdaq: AIP), a leading provider of semiconductor technology for accelerating innovation in the AI era, today announced a collaboration with IC-Link by imec, imec’s design and manufacturing service ...
DATAQUEST

Cadence and Samsung Foundry deepen 2nm and 3D‑IC collaboration to meet surging AI infrastructure and physical AI demand

All of the above from Cadence will be on Samsung Foundry’s second-generation 2nm node for next-generation AI infrastructure ...
Nasdaq

Ansys Enables 3D Multiphysics Visualization of Next-Generation 3D-IC Designs with NVIDIA Omniverse

PITTSBURGH, June 19, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights ...
Mena FN

Top IC Manufacturer Driving Next-Generation Semiconductor Innovation With Advanced Packaging And Power Solutions

In a rapidly evolving semiconductor landscape, GNS Components Limited is emerging as a notable participant among global IC supply chain contributors, as demand for high-performance integrated circuits ...
Nasdaq

Alpha and Omega Semiconductor Supports 800 VDC Power Architecture for Next-Generation AI Factories with Innovative SiC and GaN, Power MOSFET, and Power IC Solutions

The shift from traditional 54V power distribution to an 800 VDC system is a fundamental change in data center design, aimed at overcoming the physical limits of existing infrastructure. By reducing ...