Munich, Germany – ST and Infineon have joined forces with STATS ChipPAC, a leader in advanced three dimensional (3D) packaging solutions, to fully exploit the potential of Infineon's existing eWLB ...
The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...
STATS ChipPAC Ltd, a semiconductor test and packaging service provider, today announced it has ramped first-generation embedded wafer-level ball grid array (eWLB) technology to high-volume production.
Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...
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